Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al
Title | Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al |
Publication Type | Journal Article |
Year of Publication | 2007 |
Authors | Chen, S.D., F.J. Ke, and M Zhou |
Corporate Authors | Chen, S.D. |
Journal | Acta Materialia |
Volume | 55 |
Start Page | 3169 |