Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al
| Title | Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al |
| Publication Type | Journal Article |
| Year of Publication | 2007 |
| Authors | Chen, S.D., F.J. Ke, and M Zhou |
| Corporate Authors | Chen, S.D. |
| Journal | Acta Materialia |
| Volume | 55 |
| Start Page | 3169 |